Part Number Hot Search : 
4FCT2 FR305 EDREDRED 94U105 G1117 5231B ISL782 C35005
Product Description
Full Text Search
 

To Download HBC817 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6831 Issued Date : 1994.01.25 Revised Date : 2002.10.24 Page No. : 1/3
HBC817
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC817 is designed for switching and AF amplifier amplification suitable for driver stages and low power output stages.
Absolute Maximum Ratings
SOT-23
* Maximum Temperatures Storage Temperature .......................................................................................... -55 to +150 C Junction Temperature.................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 225 mW * Maximum Voltages and Currents (Ta=25C) VCES Collector to Base Voltage ......................................................................................... 50 V VCEO Collector to Emitter Voltage...................................................................................... 45 V VEBO Emitter to Base Voltage.............................................................................................. 5 V IC Collector Current ....................................................................................................... 800 mA
Characteristics (Ta=25C)
Symbol BVCEO BVCES BVEBO ICES IEBO *VCE(sat) VBE(on) *hFE fT Cob Min. 45 50 5 100 Typ. 100 Max. 100 100 700 1.2 630 12 Unit V V V nA nA mV V MHz pF Test Conditions IC=10mA IC=100uA IE=100uA VCE=25V VEB=4V IC=500mA, IB=50mA VCE=1V, IC=300mA VCE=1V, IC=100mA VCE=5V, IC=10mA. f=100MHz VCB=10V, f=1.0MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification Of hFE
Rank hFE 8FA(16) 100-250 8FB(25) 160-400 8FC(40) 250-630
HBC817
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : HE6831 Issued Date : 1994.01.25 Revised Date : 2002.10.24 Page No. : 2/3
Saturation Voltage & Collector Current
100
Saturation Voltage (mV)
hFE @ VCE=1V
hFE
100
VCE(sat) @ IC=10IB
10 0.1 1 10 100 1000
10 0.1 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000 100
Capacitance & Reverse-Biased Voltage
1000
Capacitance (pF)
On Voltage (mV)
VBE(on) @ VCE=1V
10
Cob
100 0.1 1 10 100 1000
1 0.1 1 10 100
Collector Current (mA)
Reverse-Biased Voltage (V)
Cutoff Frequency & Collector Current
1000
Cutoff Frequence (MHz)
VCE=5V
100
10 1 10 100 1000
Collector Current (mA)
HBC817
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6831 Issued Date : 1994.01.25 Revised Date : 2002.10.24 Page No. : 3/3
A L
Marking:
3 BS 1 V G 2
8F
Rank Code Control Code
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector *: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC817
HSMC Product Specification


▲Up To Search▲   

 
Price & Availability of HBC817

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X